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ProFLEX01 TRANSCEIVER MODULE
DATASHEET
CLEANING
In general, cleaning the populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
SHIPPING, HANDLING, AND STORAGE
Shipping
Bulk orders of the ProFLEX01 modules are
delivered in trays of 50.
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Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
Ultrasonic cleaning could damage the
module permanently.
Handling
The ProFLEX01 modules contain a highly
sensitive electronic circuitry. Handling without
proper ESD protection may destroy or damage
the module permanently. ESD protection may
destroy or damage the module permanently.
Moisture Sensitivity Level (MSL)
MSL 4, per J-STD-020
Devices not stored in a sealed bag with
desiccant pack should be baked.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:
After opening devices that will be subjected to
reflow must be mounted within 72 hours of
factory conditions (<30°C and 60% RH) or
stored at <10% RH.
Bake devices for 8 hours at 125°C.
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Proper alignment and centering of the
module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads, or vias.
Storage
Storage/shelf life in sealed bags is 12 months at
<40°C and <90% relative humidity.
REWORK
Repeating Reflow Soldering
The ProFLEX01 module can be unsoldered
from the host board. Use of a hot air rework
tool and hot plate for pre-heating from
underneath is recommended. Avoid
overheating.
Never attempt a rework on the
module itself, e.g.
replacing
Only a single reflow
process is encouraged
boards.
soldering
for host
individual components. Such actions
will terminate warranty coverage.
The information in this document is subject to change without notice.
330-0001-R3.0
Copyright ? 2009-2012 LS Research, LLC
Page 25 of 35
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